Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6254923 | Solder particle deposition | Alexander Boyd, William L. French, SR., Stuart Lees, Kenneth Skene Murray | 2001-07-03 |
| 6012624 | Solder apparatus and method | William L. French, SR., Stuart Lees, Colin David McCall, Kenneth Skene Murray | 2000-01-11 |
| 5829667 | Method for strengthening a solder joint when attaching integrated circuits to printed circuit boards | Frank J. Martin | 1998-11-03 |
| 5788143 | Solder particle deposition | Alexander Boyd, William L. French, SR., Stuart Lees, Kenneth Skene Murray | 1998-08-04 |
| 5758815 | Solder apparatus and method | William L. French, SR., Stuart Lees, Colin David McCall, Kenneth Skene Murray | 1998-06-02 |
| 5613633 | Solder apparatus and method | William L. French, SR., Stuart Lees, Colin David McCall, Kenneth Skene Murray | 1997-03-25 |
| 5570505 | Method of manufacturing a circuit module | Alan P. Downie, Peter Gallagher, John Garrity | 1996-11-05 |
| 5471368 | Module having vertical peripheral edge connection | Alan P. Downie, Peter Gallagher, John Garrity | 1995-11-28 |
| 5395643 | Method of and apparatus for depositing solder on a printed circuit board | John Brown, Kenneth Skene Murray, James Andrew McNee | 1995-03-07 |