AS

Andrew F. Szewczyk

IBM: 2 patents #32,839 of 70,183Top 50%
Motorola: 1 patents #6,475 of 12,470Top 55%
📍 Troy, NY: #172 of 610 inventorsTop 30%
🗺 New York: #38,318 of 115,490 inventorsTop 35%
Overall (All Time): #1,641,414 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
5834320 Method of assembling a semiconductor device using a magnet Wyatt Huddleston 1998-11-10
4714982 Substrate for a semiconductor package having improved I/O pin bonding Chandrika Prasad 1987-12-22
4634041 Process for bonding current carrying elements to a substrate in an electronic system, and structures thereof Chandrika Prasad 1987-01-06