TY

Takahiro Yada

IC Ibiden Co.: 3 patents #258 of 730Top 40%
AJ Amkor Technology Japan: 2 patents #1 of 6Top 20%
AT Amkor Technology: 1 patents #386 of 595Top 65%
Overall (All Time): #795,694 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
11967565 Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devices Tsukasa TAKAIWA 2024-04-23
11362041 Semiconductor devices including shielding layer and methods of manufacturing semiconductor devices Tsukasa TAKAIWA 2022-06-14
10312186 Heat sink attached to an electronic component in a packaged device Toru Takahashi 2019-06-04
8926785 Multi-piece board and method for manufacturing the same 2015-01-06
8741411 Multi-piece board and method for manufacturing the same 2014-06-03
8547702 Multi-piece board and method for manufacturing the same Takahiro Yamazaki, Sumiki Muto 2013-10-01