SI

Seiji Izawa

IC Ibiden Co.: 5 patents #175 of 730Top 25%
📍 Ibigawa, JP: #26 of 103 inventorsTop 30%
Overall (All Time): #926,014 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
11935801 Electronic component built-in wiring board and method for manufacturing the same Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino +1 more 2024-03-19
11792937 Component built-in wiring substrate Takahiro Yamada, Katsuyuki Sano 2023-10-17
11437290 Electronic component built-in wiring board and method for manufacturing the same Yusuke Tanaka, Tomohiro Futatsugi, Yuichi Nakamura, Yoshiki Matsui, Keinosuke Ino +1 more 2022-09-06
8966750 Method of manufacturing a multilayered printed wiring board Tomoyuki Ikeda, Naoaki Fujii 2015-03-03
8242379 Multilayered printed wiring board with a multilayered core substrate Tomoyuki Ikeda, Naoaki Fujii 2012-08-14