MN

Morio Nakao

IC Ibiden Co.: 3 patents #258 of 730Top 40%
TI Texas Instruments: 2 patents #5,248 of 12,488Top 45%
📍 Beppu, JP: #27 of 60 inventorsTop 45%
Overall (All Time): #1,577,009 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7568922 Printed wiring board having a solder pad and a method for manufacturing the same Takahiro Yamashita, Hiroyuki Watanabe, Kiyotaka Tsukada, Michio Ido 2009-08-04
6232558 Electronic component mounting base board having heat slug with slits and projections Kiyotaka Tsukada, Hisashi Minoura, Koji Asano, Naoto Ishida 2001-05-15
5914859 Electronic component mounting base board and method of producing the same Masaru Takada, Kiyotaka Tsukada 1999-06-22