MA

Masakazu Aoyama

IC Ibiden Co.: 36 patents #14 of 730Top 2%
Overall (All Time): #94,572 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 26–36 of 36 patents

Patent #TitleCo-InventorsDate
8212363 Multilayer printed wiring board Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura 2012-07-03
8181341 Method of forming a multilayer printed wiring board having a bulged via Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura 2012-05-22
8178789 Wiring board and method of manufacturing wiring board Michimasa Takahashi 2012-05-15
8071883 Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same Michimasa Takahashi 2011-12-06
8040685 Stacked wiring board and method of manufacturing stacked wiring board Michimasa Takahashi 2011-10-18
8035983 Wiring board and method of manufacturing wiring board Michimasa Takahashi 2011-10-11
7982135 Flex-rigid wiring board and method of manufacturing the same Michimasa Takahashi 2011-07-19
7973249 Multilayer printed wiring board Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura 2011-07-05
7834273 Multilayer printed wiring board Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura 2010-11-16
7759582 Multilayer printed wiring board Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura 2010-07-20
7626829 Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board Yasuhiro Watanabe, Michimasa Takahashi, Takenobu Nakamura, Hiroyuki Yanagisawa 2009-12-01