Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11748545 | Method and electronic device for configuring signal pads between three-dimensional stacked chips | Yu-Jung Huang, Mong-Na Lo Huang, Tzu-Lun Yuan | 2023-09-05 |
| 10776559 | Defect detection method for multilayer daisy chain structure and system using the same | Yu-Jung Huang, Chung-Long Pan | 2020-09-15 |
| 10303823 | Defect detection method for 3D chip and system using the same | Yu-Jung Huang, Chung-Long Pan, Shih-Chun Lin | 2019-05-28 |
| 10063282 | Chip-to-chip signal transmission system and method for arranging chips thereof | Yu-Jung Huang | 2018-08-28 |