Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11786965 | Motor plate type coil forming apparatus | Kyoung Young Kim, Ji Hun Son, Sangbum Kim, Kimyoung Kwon | 2023-10-17 |
| 7115446 | Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same | Hyoung Chan Kim | 2006-10-03 |