Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429453 | Substrate assembly for burn in test of integrated circuit chip | — | 2002-08-06 |
| 6103553 | Method of manufacturing a known good die utilizing a substrate | — | 2000-08-15 |
| 6080931 | Semiconductor package | Kil-Sub Roh | 2000-06-27 |
| 5834836 | Multi-layer bottom lead package | Kil-Sub Roh | 1998-11-10 |