MH

Matthias Heschel

HA Hymite A/S: 10 patents #1 of 12Top 9%
EP Epcos Pte: 2 patents #4 of 20Top 20%
MA Microtronic Ag: 1 patents #9 of 20Top 45%
TSMC: 1 patents #8,466 of 12,232Top 70%
TL Tsmc Solid State Lighting: 1 patents #61 of 86Top 75%
Overall (All Time): #324,901 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
8552460 Package for a light emitting element Thomas Murphy, Andreas A. Hase 2013-10-08
8044412 Package for a light emitting element Thomas Murphy, Andreas A. Hase 2011-10-25
RE42346 Solid state silicon-based condenser microphone Pirmin Hermann Otto Rombach, Matthias Mullenborn, Ole Hansen, Siebe Bouwstra, Maja Amskov Gravad +1 more 2011-05-10
RE42347 Solid state silicon-based condenser microphone Pirmin Hermann Otto Rombach, Matthias Mullenborn, Ole Hansen, Siebe Bouwstra, Maja Amskov Gravad +1 more 2011-05-10
7732234 Fabrication process for package with light emitting device on a sub-mount Christoffer G. Greisen, Lior Shiv, Steen Weichel 2010-06-08
7681306 Method of forming an assembly to house one or more micro components Arnd Kilian 2010-03-23
7419853 Method of fabrication for chip scale package for a micro component Jochen Kuhmann 2008-09-02
7388285 Hermetically sealed package for optical, electronic, opto-electronic and other devices Kristian Blidegn, Jorgen Hoeg 2008-06-17
7253388 Assembly with self-alignment features to position a cover on a substrate that supports a micro component Jochen Kuhmann 2007-08-07
7213978 Optical device receiving substrate and optical device holding carrier Jochen Kuhmann 2007-05-08
7109580 Hermetically sealed package for optical, electronic, opto-electronic and other devices Kristian Blidegn, Jorgen Hoeg 2006-09-19
7081412 Double-sided etching technique for semiconductor structure with through-holes 2006-07-25
7057274 Semiconductor structures having through-holes sealed with feed-through metalization 2006-06-06
6818464 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes 2004-11-16
6088463 Solid state silicon-based condenser microphone Pirmin Hermann Otto Rombach, Matthias Mullenborn, Ole Hansen, Siebe Bouwstra, Maja Amskov Gravad +1 more 2000-07-11