Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6396710 | High density interconnect module | Craig Iwami, Jim Hall, Brian R. Mulholland | 2002-05-28 |
| 5743990 | Thin laminate removal process tooling and method | Craig Iwami, Cunegundis T. Cura, Vincente Soto | 1998-04-28 |