Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5814174 | Method for repair of metallization on circuit board substrates | — | 1998-09-29 |
| 5150196 | Hermetic sealing of wafer scale integrated wafer | Kio Yamamoto | 1992-09-22 |
| 5052102 | Laser induced electrical connection of integrated circuits | Flora Yeung | 1991-10-01 |