Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5768109 | Multi-layer circuit board and semiconductor flip chip connection | Jon J. Gulick | 1998-06-16 |
| 5461196 | Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls | Kathleen L. Virga, Terry C. Cisco, Joseph N. Owens | 1995-10-24 |
| 5157364 | Airline transmission structures in low temperature co-fired ceramic | Ramona G. Pond, Louis W. Hendrick | 1992-10-20 |
| 5150088 | Stripline shielding techniques in low temperature co-fired ceramic | Kathleen L. Virga, Joseph N. Owens | 1992-09-22 |