Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309227 | Chip package structure having a package substrate disposed around a die | Jianping Fang, Haohui Long, Hui Si | 2022-04-19 |
YL
Yanqin Liao
Overall (All Time): #2,650,081 of 4,157,543Top 65%
1
Patents All Time