Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251136 | Flip-chip die package structure and electronic device | Wei Wu, Ding Li, Hongcheng Yin | 2022-02-15 |
XK
Xiongcai Kuang
Overall (All Time): #2,637,774 of 4,157,543Top 65%
1
Patents All Time