Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266617 | Chip package, electronic device, and chip package preparation method | Nan Zhao, Chunghsuan Tsai | 2025-04-01 |
| 11276645 | Encapsulation of a substrate electrically connected to a plurality of pin arrays | Nan Zhao, Wenxu Xie, Junlei TAO, HuiLi Fu | 2022-03-15 |