Renjun Dai — 3 Patents at Huawei

Renjun Dai has been granted 3 US patents while listed as an inventor at Huawei. The first was granted in 2021 and the most recent in November 2022. Renjun Dai ranks #1,328,092 of 4,157,543 US inventors in our database (top 31.9%). Patent records list Renjun Dai in Shanghai, CN.

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #	Title	Co-Inventors	Date
11494154	Processing method and handheld device	Hongliang Liu	2022-11-08
11418049	Wireless charging/discharging method and wireless charging and discharging device	—	2022-08-16
11061464	Electronic device, method for reducing power consumption, and apparatus	—	2021-07-13

Renjun Dai — 3 Patents

Issued Patents All Time

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