Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156512 | System and method for measuring thermal reliability of multi-chip modules | Qian Han, Yongwang Xiao | 2018-12-18 |
| 9967987 | Electronic device enclosure and electronic device | Lue Sun | 2018-05-08 |
| 9798365 | Apparatus for preventing deformation of communication card | — | 2017-10-24 |