JH

Junfu Hu

Huawei: 2 patents #5,439 of 15,535Top 40%
Overall (All Time): #1,827,551 of 4,157,543Top 45%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11823996 Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same Hamit Duran 2023-11-21
11251116 Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same Hamit Duran 2022-02-15