Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7470619 | Interconnect with high aspect ratio plugged vias | Mary Y. Chen, James Chingwei Li, Marko Sokolich | 2008-12-30 |
| 6828677 | Precision electroplated solder bumps and method for manufacturing thereof | Daniel Yap | 2004-12-07 |