Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8024146 | Multi-gas flow sensor with gas specific calibration capability | Paul Prehn Bey | 2011-09-20 |
| 7892488 | Thermal liquid flow sensor and method of forming same | Jamie Speldrich, Scott Edward Beck, Martin Murray, Ulrich Bonne | 2011-02-22 |
| 7769557 | Multi-gas flow sensor with gas specific calibration capability | Paul Prehn Bey | 2010-08-03 |
| 7278309 | Interdigitated, full wheatstone bridge flow sensor transducer | Anthony M. Dmytriw, Wayne T. Kilian, Jamie Speldrich, Scott Edward Beck, Gilberto Morales | 2007-10-09 |
| 7278308 | Thermal isolation between heating and sensing for flow sensors | Michael G. Marchini, Martin Murray | 2007-10-09 |
| 7249503 | Tube and die interface for liquid flow sensing through the tube | James Liu, Michael G. Marchini | 2007-07-31 |
| 7243541 | Combi-sensor for measuring multiple measurands in a common package | Paul Prehn Bey, Anthony M. Dmytriw, Christopher M. Blumhoff, Craig Scott Becke, Jamie Speldrich | 2007-07-17 |
| 7174798 | Alignment device for positioning liquid flow tube | Duane J. Sies, Michael G. Marchini | 2007-02-13 |
| 6973819 | Differential compensated vapor sensor | Robert M. Ruhland, Peter Anderson, Peter M. Calvagna | 2005-12-13 |
| 6916664 | Flammable vapor sensor | Ulrich Bonne | 2005-07-12 |
| 6904907 | Indirect flow measurement through a breath-operated inhaler | Jamie Speldrich, Martin Murray | 2005-06-14 |
| 6883366 | Tamper resistant vapor sensor method and system | Todd H. Sellman, Richard C. Cholke, Michael Hoefer | 2005-04-26 |
| 6871537 | Liquid flow sensor thermal interface methods and systems | Richard A. Alderman, Brian Speldrich | 2005-03-29 |
| 6591674 | SYSTEM FOR SENSING THE MOTION OR PRESSURE OF A FLUID, THE SYSTEM HAVING DIMENSIONS LESS THAN 1.5 INCHES, A METAL LEAD FRAME WITH A COEFFICIENT OF THERMAL EXPANSION THAT IS LESS THAN THAT OF THE BODY, OR TWO RTDS AND A HEAT SOURCE | Christopher M. Blumhoff, Jamie Speldrich | 2003-07-15 |
| 6153070 | Sensor packaging using heat staking technique | D. Joseph Maurer, Said Karbassi | 2000-11-28 |