Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8188561 | Integral topside vacuum package | Robert E. Higashi, Karen M. Newstrom-Peitso | 2012-05-29 |
| 7875944 | Integral topside vacuum package | Robert E. Higashi, Karen M. Newstrom-Peitso | 2011-01-25 |
| 7549206 | Shell flow sensor | Robert E. Higashi, Son T. Lu | 2009-06-23 |
| 7396476 | Method for reducing harmonic distortion in comb drive devices | James Neus | 2008-07-08 |
| 7396698 | Methods and systems for providing MEMS devices with a top cap and upper sense plate | Robert D. Horning | 2008-07-08 |
| 7276798 | Integral topside vacuum package | Robert E. Higashi, Karen M. Newstrom-Peitso | 2007-10-02 |
| RE39143 | Method for making a wafer-pair having sealed chambers | R. Andrew Wood, Robert E. Higashi | 2006-06-27 |
| 7012322 | Method for reducing harmonic distortion in comb drive devices | James Neus | 2006-03-14 |
| 7005732 | Methods and systems for providing MEMS devices with a top cap and upper sense plate | Robert D. Horning | 2006-02-28 |
| 6924165 | Methods and systems for buried electrical feedthroughs in a glass-silicon MEMS process | Robert D. Horning | 2005-08-02 |
| 6888233 | Systems for buried electrical feedthroughs in a glass-silicon MEMS process | Robert D. Horning | 2005-05-03 |
| 6808956 | Thin micromachined structures | Cleopatra Cabuz | 2004-10-26 |
| 6582985 | SOI/glass process for forming thin silicon micromachined structures | Cleopatra Cabuz | 2003-06-24 |
| 6359333 | Wafer-pair having deposited layer sealed chambers | R. Andrew Wood, Robert E. Higashi | 2002-03-19 |
| 6287940 | Dual wafer attachment process | Barrett E. Cole, Robert E. Higashi | 2001-09-11 |
| 6246305 | Apparatus and method for operating a micromechanical switch | Daniel Youngner | 2001-06-12 |
| 6040749 | Apparatus and method for operating a micromechanical switch | Daniel Youngner | 2000-03-21 |
| 6036872 | Method for making a wafer-pair having sealed chambers | R. Andrew Wood, Robert E. Higashi | 2000-03-14 |
| 5895233 | Integrated silicon vacuum micropackage for infrared devices | Robert E. Higashi, Thomas G. Stratton, R. Andrew Wood | 1999-04-20 |
| 4914742 | Thin film orthogonal microsensor for air flow and method | Robert E. Higashi, James O. Holmen, Steven D. James, Robert G. Johnson | 1990-04-03 |
| 4895616 | Method for making thin film orthogonal microsensor for air flow | Robert E. Higashi, James O. Holmen, Steven D. James, Robert G. Johnson | 1990-01-23 |
| 4891977 | Microbridge sensor bonding pad design for improved adhesion | Robert G. Johnson, James O. Holmen | 1990-01-09 |
| 4784721 | Integrated thin-film diaphragm; backside etch | James O. Holmen, Steven D. James | 1988-11-15 |