YA

Yukiharu Akiyama

HI Hitachi: 16 patents #2,438 of 28,497Top 9%
HC Hitachi Ulsi Systems Co.: 6 patents #125 of 867Top 15%
RT Renesas Technology: 6 patents #492 of 3,337Top 15%
Sharp Kabushiki Kaisha: 5 patents #3,007 of 10,731Top 30%
AC Akita Electronics Co.: 3 patents #12 of 68Top 20%
HE Hitachi Vlsi Engineering: 2 patents #292 of 666Top 45%
Mitsubishi Electric: 2 patents #11,187 of 25,717Top 45%
HS Hitachi Microcomputer System: 2 patents #67 of 257Top 30%
Rohm Co.: 2 patents #1,039 of 2,292Top 50%
SC Sanyo Electric Co.: 1 patents #3,644 of 6,347Top 60%
AC Akita Electronics Systems Co.: 1 patents #3 of 36Top 9%
📍 Koganei, JP: #21 of 449 inventorsTop 5%
Overall (All Time): #132,366 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 26–29 of 29 patents

Patent #TitleCo-InventorsDate
5493139 Electrically erasable PROM (E.sup.2 PROM) with thin film peripheral transistor Shin Sato 1996-02-20
5176310 Method and apparatus for wire bond Yoshio Oshima 1993-01-05
5110032 Method and apparatus for wire bonding Yoshio Oshima 1992-05-05
5037023 Method and apparatus for wire bonding Yoshio Oshima 1991-08-06