Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5621243 | Semiconductor device having thermal stress resistance structure | Noboru Baba, Hisanori Okamura, Masahiko Sakamoto, Hirosi Akiyama, Ryuichi Saito +4 more | 1997-04-15 |
| 5585672 | Semiconductor module with an improved heat sink/insulation plate arrangement | Yoshihiko Koike, Ryuichi Saito, Yuuji Wakisawa | 1996-12-17 |
| 5446318 | Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement | Yoshihiko Koike, Ryuichi Saito, Yuuji Wakisawa | 1995-08-29 |