Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5851681 | Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board | Haruhiko Matsuyama, Eiji Matsuzaki, Fumio Kataoka, Fusaji Shoji | 1998-12-22 |