Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800945 | Multi-chip semiconductor device with specific chip arrangement | Yasuhiro Naka, Ikuo Yoshida, Satoshi Imasu, Takahiro Naito | 2004-10-05 |
| 6727583 | Semiconductor device | Yasuhiro Naka, Ikuo Yoshida, Satoshi Imasu, Takahiro Naito | 2004-04-27 |
| 6710610 | Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device | Hiroyuki Ohta, Ichiro Anjoh, Hideo Arima, Akio Hasebe, Kenichi Yamamoto | 2004-03-23 |
| 6646350 | Semiconductor device | Hideo Miura, Yoshiyuki Kado, Ikuo Yoshida, Takahiro Naito | 2003-11-11 |
| 6465876 | Semiconductor device and lead frame therefor | Makoto Kitano, Akihiro Yaguchi, Takeshi Terasaki, Ichiro Anjoh, Ryo Haruta +2 more | 2002-10-15 |
| 6423571 | Method of making a semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa +4 more | 2002-07-23 |
| 6314819 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 2001-11-13 |
| 6297073 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Akihiro Yaguchi, Tetsuo Kumazawa, Ichiro Anjoh +5 more | 2001-10-02 |
| 6232653 | TSOP type semiconductor device | Akihiro Yaguchi, Ryuji Kohno, Kiyomi Kojima, Takeshi Terasaki, Hideo Miura +2 more | 2001-05-15 |
| 6130112 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Akihiro Yaguchi, Tetsuo Kumazawa, Ichiro Anjoh +5 more | 2000-10-10 |
| 6070473 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 2000-06-06 |
| 6049128 | Semiconductor device | Makoto Kitano, Ryuji Kohno, Akihiro Yaguchi, Tetsuo Kumazawa, Ichiro Anjoh +5 more | 2000-04-11 |
| 6028364 | Semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Shuji Eguchi, Toshiaki Ishii, Masanori Segawa +4 more | 2000-02-22 |
| 5895965 | Semiconductor device | Makoto Kitano, Akihiro Yaguchi, Ichiro Anjoh, Hideki Tanaka, Asao Nishimura | 1999-04-20 |
| 5837567 | Lead frame and semiconductor device | Akihiro Yaguchi, Makoto Kitano, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura +2 more | 1998-11-17 |
| 5698790 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 1997-12-16 |
| 5637914 | Lead frame and semiconductor device encapsulated by resin | Akihiro Yaguchi, Makoto Kitano, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura +2 more | 1997-06-10 |
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +1 more | 1997-03-04 |
| 5569960 | Electronic component, electronic component assembly and electronic component unit | Tetsuo Kumazawa, Makoto Kitano, Akihiro Yaguchi, Ryuji Kohno, Nae Yoneda +1 more | 1996-10-29 |
| 5537884 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 1996-07-23 |
| 5359899 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 1994-11-01 |