Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5200366 | Semiconductor device, its fabrication method and molding apparatus used therefor | Tomio Yamada, Hiroi Oka, Atsusi Nakamura, Kunihiko Nishi, Kazuo Yamazaki +1 more | 1993-04-06 |