Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796820 | Semiconductor wafer and semiconductor device wafer | Shusei Nemoto | 2014-08-05 |
| 7267604 | Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method | Chie Yoshizawa, Satoshi Uematsu, Takehiko Tani | 2007-09-11 |