TS

Takaki Saitou

HS Hitachi Hokkai Semiconductor: 1 patents #44 of 98Top 45%
RT Renesas Technology: 1 patents #1,991 of 3,337Top 60%
📍 Ayase, JP: #223 of 339 inventorsTop 70%
Overall (All Time): #3,477,297 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6727119 Method of encapsulating a semiconductor device attached to a wiring substrate using sealing resin — 2004-04-27