Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193845 | Ultrahigh sensitive pressure-sensing film based on spiky hollow carbon spheres and the fabrication method thereof | Limin Wu | 2021-12-07 |
| 6742694 | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus | Takuya Satoh, Tatsumi Tsuchiya, Yasuhiro Mita, Hiroyoshi Yokome, Tatsushi Yoshida +1 more | 2004-06-01 |