SS

Shinji Sugizaki

HC Hitachi Electronics Engineering Co.: 2 patents #32 of 175Top 20%
Overall (All Time): #2,194,612 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6790300 Method and apparatus for bonding substrate plates together through gap-forming sealer material Hiroyuki Watanabe, Yuji Otsubo, Hisayoshi Ichikawa, Hiroaki Kiyomiya 2004-09-14
6004487 Method and apparatus for laser-texturing disk surfaces Kenya Wada, Hisayoshi Ichikawa, Kazuto Kinoshita 1999-12-21