Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4764235 | Process and apparatus for sealing semiconductor packages | Shin'ichi Ota, Mituo Yamada, Toshiyuki Arai | 1988-08-16 |
| 4751611 | Semiconductor package structure | Toshiyuki Arai, Shin'ichi Ota | 1988-06-14 |
| 4722441 | Package structure for semiconductors | Toshiyuki Arai, Shinichi Ota, Kiichi Kanamaru | 1988-02-02 |
| 4305897 | Packaging process for semiconductors | Yo Maeda, Shinichi Ohta | 1981-12-15 |