Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840619 | Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board | Yoshitaka Takezawa, Shingo Tanaka | 2023-12-12 |
| 10597485 | Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resin | Shingo Tanaka, Tomoko Higashiuchi, Naoki Maruyama, Kazumasa Fukuda, Yoshitaka Takezawa | 2020-03-24 |
| 10584228 | Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board | Yoshitaka Takezawa, Shingo Tanaka | 2020-03-10 |
| 10186473 | Power module | Nobutake Tsuyuno, Toshiaki Ishii, Junpei Kusukawa, Akira Matsushita | 2019-01-22 |
| 9249293 | Composite particle, method for producing the same, and resin composition | Yoshitaka Takezawa, Shingo Tanaka, Hiroyuki Kagawa | 2016-02-02 |