WZ

Wangjun Zhang

HU Hisense Usa: 2 patents #173 of 316Top 55%
HC Hisense Electric Co.: 1 patents #68 of 151Top 50%
HC Hisense Hiview Tech Co.: 1 patents #6 of 37Top 20%
TU Tsinghua University: 1 patents #1,221 of 2,815Top 45%
📍 Qingdao, CN: #389 of 2,087 inventorsTop 20%
Overall (All Time): #1,494,101 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9676129 Double-layer injection molding casing and method for manufacturing the same, electronic apparatus Dejun Wang, Haode Jiang 2017-06-13
9395758 Back housing and display device Yong Zhang 2016-07-19
8150640 Method for state estimation based on the measured data of the data-acquisition system in power system Guangyu He, Shufeng Dong, Yingyun Sun, Shengwei Mei, Wei Wang 2012-04-03