DL

David A. Lysack

HD High Connection Density: 2 patents #6 of 19Top 35%
Overall (All Time): #2,200,495 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6540525 High I/O stacked modules for integrated circuits Che-Yu Li, Brian D. Harry, John J. Kresse 2003-04-01
6496380 High capacity memory module with high electrical design margins Che-Yu Li, Thomas L. Sly 2002-12-17