Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6451406 | Solventless node adhesive for honeycomb | Yen-Seine Wang | 2002-09-17 | $2,017,000 |
| 6245407 | Thermoformable honeycomb structures | Yen-Seine Wang, Emi Lee, Robert A. Petrisko | 2001-06-12 | $2,972,000 |
| 6153687 | Honeycomb dip resin | Yen-Seine Wang | 2000-11-28 | $5,371,000 |
| 5527584 | High thermal conductivity triaxial non-metallic honeycomb | Stephen C. Darfler, Carla Ahlstrom | 1996-06-18 | $5,264,000 |