Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10568206 | Printed circuit board assembly and assembling method thereof | Yi-Hwa Hsieh | 2020-02-18 | |
| 10568207 | Printed circuit board assembly and assembling method thereof | Yi-Hwa Hsieh | 2020-02-18 | |
| 10321565 | Printed circuit board assembly and assembling method thereof | Yi-Hwa Hsieh | 2019-06-11 | |
| 5338594 | Foam filled honeycomb and methods for their production | Yen-Seine Wang, Frank Wen-Chi Lee, Ken Baron | 1994-08-16 | $556,000 |
| 5077319 | Cyanate resin-based foams | Yen-Seine Wang, David Bernard Conway, Frank Wen-Chi Lee, Kenneth S. Baron | 1991-12-31 | $789,000 |
| 4939019 | Compositions and process for producing foam plastics | Mark K. Robertson, Kyu-Wang Lee | 1990-07-03 | $732,000 |
| 4918110 | Compositions and process for producing foam plastics | Mark K. Robertson, Kyu-Wang Lee | 1990-04-17 | $652,000 |