Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7480994 | Method of making a fluid ejection head for a fluid ejection device | Benjamin H. Wood, Joseph E. Scheffelin, Noah Lassar | 2009-01-27 |
| 7338149 | Methods for forming and protecting electrical interconnects and resultant assemblies | Joseph E. Scheffelin, Noah Lassar, Conrad Lepe | 2008-03-04 |
| 7211736 | Connection pad layouts | Noah Lassar, Michael Martin | 2007-05-01 |
| 7188925 | Fluid ejection head assembly | Benjamin H. Wood, Joseph E. Scheffelin, Noah Lassar | 2007-03-13 |
| 7103969 | Methods and systems for forming a die package | Frank Bretl, Gary Powell, Donald L. Michael, Jefferson P. Ward, Joseph E. Scheffelin | 2006-09-12 |
| 6983539 | Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps | Ghassem Azdasht | 2006-01-10 |
| 6951778 | Edge-sealed substrates and methods for effecting the same | Stanley G. Markwell, Janis Horvath, Joseph E. Scheffelin | 2005-10-04 |
| 6913343 | Methods for forming and protecting electrical interconnects and resultant assemblies | Joseph E. Scheffelin, Noah Lassar, Conrad Lepe | 2005-07-05 |
| 6843552 | Electrical circuit for printhead assembly | David K. McElfresh, Noah Lassar, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath +1 more | 2005-01-18 |
| 6705705 | Substrate for fluid ejection devices | Janis Horvath, Brian J. Keefe, Joseph E. Scheffelin, David K. McElfresh, Noah Lassar | 2004-03-16 |
| 6698092 | Methods and systems for forming a die package | Frank Bretl, Gary Powell, Donald L. Michael, Jefferson P. Ward, Joseph E. Scheffelin | 2004-03-02 |
| 6575559 | Joining of different materials of carrier for fluid ejection devices | David K. McElfresh, Joseph E. Scheffelin, Gerald V. Rapp, Janis Horvath | 2003-06-10 |
| 6557976 | Electrical circuit for wide-array inkjet printhead assembly | David K. McElfresh, Noah Lassar, Brian J. Keefe, Joseph E. Scheffelin, Janis Horvath +1 more | 2003-05-06 |
| 6543880 | Inkjet printhead assembly having planarized mounting layer for printhead dies | Robert-Scott Melendrino Lopez, Brian J. Keefe, Janis Horvath, Joseph E. Scheffelin, David K. Mc Elfresh | 2003-04-08 |
| 6476346 | Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding | Say-Teng Lai, Robert-Scott Melendrino Lopez | 2002-11-05 |
| 6450614 | Printhead die alignment for wide-array inkjet printhead assembly | Joseph E. Scheffelin, Melissa D. Boyd, James W. Ring, Janis Horvath | 2002-09-17 |
| 6431683 | Hybrid carrier for wide-array inkjet printhead assembly | May F. Ho, Joseph E. Scheffelin, Brian J. Keefe, Janis Horvath | 2002-08-13 |
| 6428141 | Reference datums for inkjet printhead assembly | David K. Mc Elfresh, Joseph E. Scheffelin | 2002-08-06 |
| 6409307 | Coplanar mounting of printhead dies for wide-array inkjet printhead assembly | Robert-Scott Melendrino Lopez, Dale Timm, Janis Horvath, Noah Lassar, David K. McElfresh +2 more | 2002-06-25 |
| 6397465 | Connection of electrical contacts utilizing a combination laser and fiber optic push connect system | Ghassem Azdasht | 2002-06-04 |
| 6350013 | Carrier positioning for wide-array inkjet printhead assembly | Joseph E. Scheffelin, Melissa D. Boyd, James W. Ring, Janis Horvath | 2002-02-26 |
| 6236015 | Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding | Say-Teng Lai, Robert-Scott Melendrino Lopez | 2001-05-22 |
| 5341564 | Method of fabricating integrated circuit module | Ken W. Economy | 1994-08-30 |