Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7372147 | Supporting a circuit package including a substrate having a solder column array | Xiang Dai | 2008-05-13 |
| 7171742 | Method and system for assembling a printed circuit board using a land grid array | Rudy Rivera, James D. Hensley | 2007-02-06 |
| 6923658 | Support for an integrated circuit package having a column grid array interconnect | Xiang Dai | 2005-08-02 |
| 6660563 | Method and system for assembling a printed circuit board using a land grid array | Rudy Rivera, James D. Hensley | 2003-12-09 |