| 8021935 |
Thin film device fabrication process using 3D template |
Ping Mei, Hao Luo, Albert Jeans, Angeles Marcia Almanza-Workman, Robert A. Garcia +2 more |
2011-09-20 |
| 7678626 |
Method and system for forming a thin film device |
Ping Mei |
2010-03-16 |
| 7541227 |
Thin film devices and methods for forming the same |
Ping Mei, Albert Jeans, Carl Taussig |
2009-06-02 |
| 7304364 |
Embossed mask lithography |
Carl Taussig, Ping Mei |
2007-12-04 |
| 7199025 |
Fabrication and assembly structures and methods for memory devices |
Christopher A. Schantz |
2007-04-03 |
| 7084007 |
Fabrication and assembly structures and methods for memory devices |
Christopher A. Schantz |
2006-08-01 |
| 6919633 |
Multi-section foldable memory device |
Christopher A. Schantz |
2005-07-19 |
| 6887792 |
Embossed mask lithography |
Carl Taussig, Ping Mei |
2005-05-03 |
| 6867132 |
Large line conductive pads for interconnection of stackable circuitry |
Carl Taussig |
2005-03-15 |
| 6864576 |
Large line conductive pads for interconnection of stackable circuitry |
Carl Taussig |
2005-03-08 |
| 6813182 |
Diode-and-fuse memory elements for a write-once memory comprising an anisotropic semiconductor sheet |
Stephen Forrest |
2004-11-02 |
| 6690597 |
Multi-bit PROM memory cell |
Ping Mei |
2004-02-10 |
| 6683322 |
Flexible hybrid memory element |
Warren B. Jackson, Carl Taussig |
2004-01-27 |
| 6646912 |
Non-volatile memory |
Terril N. Hurst, Carol J. Wilson, Carl Taussig |
2003-11-11 |
| 5557596 |
Ultra-high density storage device |
Gary Gibson, Theodore I. Kamins, Marvin S. Keshner, Steven L. Neberhuis, Chung Ching Yang |
1996-09-17 |
| 4897749 |
Combination probe and ring head for vertical recording |
Peter K. George, Mark Jursich |
1990-01-30 |
| 4788612 |
Extended metal in gap head |
— |
1988-11-29 |
| 4748525 |
Probe head for vertical recording |
— |
1988-05-31 |
| 4667260 |
Thin film vertical recording head |
Arthur Calderon |
1987-05-19 |