Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10800956 | Debondable reactive hot melt adhesives | Isabelle Ford, Julie Joseph, Alasdair James Crawford | 2020-10-13 |
| 10590310 | Electrical debonding of PU hot melt adhesives by use of conductive inks | Thomas Moeller, Siegfried Kopannia, Alasdair James Crawford | 2020-03-17 |
| 6258885 | Filling compound | Juergen Wichelhaus, Johannes Andres | 2001-07-10 |
| 6221978 | Moisture curable hot melt adhesive and method for bonding substrates using same | Yingjie Li, John T. Cain | 2001-04-24 |
| 6077900 | Aqueous polyamide dispersion composition | Chase J. Boudreaux, Timothy C. Vogel, David Devore, Stephen A. Fischer, Kartar S. Arora | 2000-06-20 |
| 5922831 | Method of manufacturing an upper for a shoe | Dwight Heinrich, Sandra Drahos | 1999-07-13 |
| 5902849 | Filling compound | Juergen Wichelhaus, Johannes Andres | 1999-05-11 |
| 5883172 | Polyamide hotmelt adhesive | Siegfried Kopannia, Ulrike Maassen | 1999-03-16 |
| 5807968 | Polyamide compositions and related methods | Dwight Heinrich, Sandra Drahos | 1998-09-15 |
| 5804682 | Aqueous dispersions of polyamides | Stephen A. Fischer, David Devore, Kartar S. Arora, Michael S. Wiggins, Chase J. Boudreaux +1 more | 1998-09-08 |
| 5770680 | Aqueous dispersions of polyamides | Stephen A. Fischer, David Devore, Kartar S. Arora | 1998-06-23 |
| 5723538 | Aqueous dispersions of polyamides | Stephen A. Fischer, David Devore, Kartar S. Arora, Michael S. Wiggins, Chase J. Boudreaux | 1998-03-03 |
| 5719255 | Polyamide based on dimer fatty acid | Bettina Becker, Angela Rossini | 1998-02-17 |
| 5548027 | Hotmelt adhesive | Juergen Wichelhaus, Kurt Schueller, Siegfried Kopannia, Angela Rossini | 1996-08-20 |
| 5519109 | Moisture-curing polyamides | Hans-Georg Kinzelmann, Juergen Wichelhaus | 1996-05-21 |
| 5510405 | Plug-type connector for coaxial cables | Juergen Wichelhaus, Kurt Schueller, Bettina Becker | 1996-04-23 |
| 5412022 | Lyo gel, its production and its use for sealing | Johannes Andres, Juergen Wichelhaus | 1995-05-02 |