Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485883 | Aqueous bonding composition | Yoshio Yoshida, Tadashi Hayakawa | 2022-11-01 |
| 11236257 | Moisture-curable hot melt adhesive | Kenji Matsuda, Ai Takamori | 2022-02-01 |
| 10611049 | Aqueous bonding composition | Yoshio Yoshida | 2020-04-07 |
| 8324299 | Moisture-curable hot melt adhesive | Hideyuki Yamakoshi | 2012-12-04 |