Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10689551 | Thermally conductive adhesive | Ruediger Butterbach, Patrick MARKIEFKA, Judith Siepenkothen, Siegfried Kopannia | 2020-06-23 |
| 9487686 | Reactive two-component hotmelt adhesive composition | Ruediger Butterbach, Siegfried Kopannia, Judith Siepenkothen | 2016-11-08 |