Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378453 | Reactive hot melt adhesive composition and use thereof | Hongye Zhu | 2025-08-05 |
| 11866535 | Two-part epoxy based composition | Chunfu Chen, Bin Li, Chao Wang | 2024-01-09 |