Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5071914 | Thermoplastic hot melt adhesive containing epoxy adduct | John M. Zimmel, William L. Bunnelle, Keith C. Knutson | 1991-12-10 |
| 4871803 | Hot melt adhesives containing an additive derived from epoxy reactive hydrogen containing polymers and compounds and a polyepoxy compound | John M. Zimmel, William L. Bunnelle, Keith C. Knutson | 1989-10-03 |