Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224221 | Packaging method and package structure | Hui-Yen Huang, Ping-Lung Wang | 2025-02-11 |
| 11699675 | Semiconductor device with high heat dissipation efficiency | Hui-Yen Huang, Ping-Lung Wang | 2023-07-11 |