Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5894983 | High frequency, low temperature thermosonic ribbon bonding process for system-level applications | Donald J. Beck, Kelly Hillman, Hector Deju, Gary A. Rief, James B. Nichols +3 more | 1999-04-20 |