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USPTO Patent Rankings Data through Dec 31, 2025
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Paul Jaynes — 16 Patents

Harris: 10 patents #129 of 2,461Top 6%
FOFoster-Miller: 4 patents #32 of 327Top 10%
Sony: 4 patents #9,005 of 25,231Top 40%
Melbourne, FL: #79 of 1,077 inventorsTop 8%
Florida: #3,136 of 67,251 inventorsTop 5%
Overall (All Time): #284,196 of 4,157,543Top 7%
16 Patents All Time
Paul Jaynes has been granted 16 US patents while listed as an inventor at Harris. The first was granted in 2000 and the most recent in August 2025. Paul Jaynes ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Paul Jaynes in Melbourne, FL, US.

Patents per Year

Patents granted per year, 2000 to 2025Bar chart with a peak of 2 patents in 2005.peak 22000: 1 patents20002003: 1 patents2005: 2 patents20052006: 1 patents2008: 1 patents20082009: 2 patents2010: 1 patents20102011: 1 patents2012: 1 patents20122015: 1 patents2018: 1 patents20182020: 1 patents2023: 1 patents20232025: 1 patents2025

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12400810 Method for making a three-dimensional liquid crystal polymer electronic device Louis Joseph Rendek, Jr., Lawrence W. Shacklette, Philip Anthony Marvin 2025-08-26
11657989 Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air Louis Joseph Rendek, Jr., Lawrence W. Shacklette, Philip Anthony Marvin 2023-05-23 $197,001,000
10818448 Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air Louis Joseph Rendek, Jr., Lawrence W. Shacklette, Philip Anthony Marvin 2020-10-27 $237,727,000
9922783 Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch Louis Joseph Rendek, Jr., Lawrence W. Shacklette, Philip Anthony Marvin 2018-03-20 $67,591,000
9117602 Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods Louis Joseph Rendek, Jr., Lawrence W. Shacklette, Philip Anthony Marvin 2015-08-25 $6,897,000
8161633 Method of fabricating non-planar circuit board Lawrence W. Shacklette, Louis Joseph Rendek, Jr., Philip Anthony Marvin 2012-04-24 $4,101,000
7972901 Chip package sealing method Brian Farrell, Malcolm E. Taylor 2011-07-05
7768619 Method and apparatus for sealing flex circuits made with an LCP substrate C. W. Sinjin Smith, Charles M. Newton 2010-08-03 $7,681,000
7591924 Apparatus for sealing flex circuits having heat sensitive circuit elements C. W. Sinjin Smith, Charles M. Newton 2009-09-22 $8,411,000
7476566 Electronic and optoelectronic component packaging technique Brian Farrell, Malcolm E. Taylor 2009-01-13
7343675 Method of constructing a structural circuit C. W. Sinjin Smith, Charles Newton, Travis L. Kerby 2008-03-18 $10,177,000
7128801 Method and apparatus for sealing flex circuits having heat sensitive circuit elements C. W. Sinjin Smith, Charles M. Newton 2006-10-31 $34,559,000
6977187 Chip package sealing method Brian Farrell, Malcolm E. Taylor 2005-12-20
6952046 Electronic and optoelectronic component packaging technique Brian Farrell, Malcolm E. Taylor 2005-10-04
6633276 Adjustable viewing angle flat panel display unit and method of implementing same — 2003-10-14 $1,201,000
D434403 Cellular telephone handset Vitale Sgambelluri 2000-11-28

Frequent Collaborators

Lawrence W. Shacklette6 shared
Philip Anthony Marvin6 shared
Louis Joseph Rendek, Jr.6 shared
Brian Farrell4 shared
Malcolm E. Taylor4 shared
C. W. Sinjin Smith4 shared

Nearby-Ranked Inventors

Chung-Lin Fu16
Tyrone T. Chen16
Shivendra Katiyar16
Kevin E. Kalajan16
Henry Y. Mark16
Marco Becker16
Nak Gi Sung16
Kenta Iwai16
Brock Mammoser16