Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11428845 | System and method for sensing seismic acoustic signals | Brian Richard Kryszczynski, Mark Andrew Tinker, Paul Armin Nyffenegger, Arthur Owen Endress | 2022-08-30 |
| 10185054 | System and method for improved seismic acoustic sensor performance | Brian Richard Kryszczynski, Mark Andrew Tinker, Paul Armin Nyffenegger | 2019-01-22 |
| 6114191 | Semiconductor packaging method | William R. Young | 2000-09-05 |
| 5965933 | Semiconductor packaging apparatus | William R. Young | 1999-10-12 |
| 5070388 | Trench-resident interconnect structure | William R. Wade | 1991-12-03 |
| 4529314 | Method of measuring misalignment between levels on a substrate | — | 1985-07-16 |
| 4464825 | Process for fabrication of high-speed radiation hard bipolar semiconductor devices | — | 1984-08-14 |
| 4409686 | Method of serialization of dice | Justin E. Harlow | 1983-10-11 |
| 4404658 | Mesa bipolar memory cell and method of fabrication | — | 1983-09-13 |
| 4292730 | Method of fabricating mesa bipolar memory cell utilizing epitaxial deposition, substrate removal and special metallization | — | 1981-10-06 |
| 4290831 | Method of fabricating surface contacts for buried layer into dielectric isolated islands | William G. Lucas | 1981-09-22 |
| 4288911 | Method for qualifying biased integrated circuits on a wafer level | — | 1981-09-15 |
| 4281449 | Method for qualifying biased burn-in integrated circuits on a wafer level | Thomas R. St. Clair | 1981-08-04 |