Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8845347 | System for receiving a head unit in a vehicle | Werner Pollak, Dieter Acker | 2014-09-30 |
| 5027995 | Process for bonding semiconductor chips to substrates | Karl Osojnik, Werner Spaeth, Guenther Waitl | 1991-07-02 |